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天润科技(430564)
融资融券更新时间:2025-06-24
指标2025-06-242025-06-232025-06-202025-06-192025-06-182025-06-172025-06-162025-06-132025-06-122025-06-112025-06-102025-06-092025-06-062025-06-052025-06-042025-06-032025-05-302025-05-292025-05-282025-05-27
融资余额(万元)555.66567.78579.56594.21978.44725.84737.01763.42753.93737.64550.1497.76578.84649.3546.76557.42564.96616.36597.23590.12
融资买入额(万元)16.7735.782.2738.13263.4512.6325.0530.5559.26234.47137.1127.08119.04161.7228.5934.9547.09109.7125.3152.21
融资偿还额(万元)28.8947.5616.93422.3510.8523.7951.4621.0542.9646.9484.76108.16189.559.1839.2642.4998.4990.5718.2123.6
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)555.66567.78579.56594.21978.44725.84737.01763.42753.93737.64550.1497.76578.84649.3546.76557.42564.96616.36597.23590.12
融资融券差额(万元)555.66567.78579.56594.21978.44725.84737.01763.42753.93737.64550.1497.76578.84649.3546.76557.42564.96616.36597.23590.12
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